WebSep 1, 2014 · The JEDEC shear test (JESD22-B117A) was modified by reducing the specified shear test height between the upper part of the solder ball and passivation layer from >7 μm to immediate contact with the passivation.This results into a height of close to 0 μm bringing direct force on the UBM layer (Fig. 3).A design of experiment was performed … WebDec 25, 2024 · Solder Ball Shear JESD22-BI17A (Revision of JESD22-BLL7, July 2000 OCTOBER 2006 JEDEC SOLID SITATE TECHNOLOGY ASSOCIATON JEDEC Electronic Industries Alliance NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and …
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WebThis test method applies to solder ball shear force/energy testing prior to end-use attachment. Solder balls are sheared individually; force, fracture energy and failure mode data are collected and analyzed. ... EIA JESD 22-B117A (2006-10) Year: 2014: Document history: EIA JESD 22-B117B (2014-05) Country: USA: Keyword: EIA JESD 22;EIA 22;EIA 22 ... Web3.2 Ball shear test and fracture surface analysis: Fig. 4 shows the effect of doping 0.1wt.% Ni into the flux on the average shear strength as a function of aging time. It is seen that the average shear strength of 0.1wt.% Ni doped flux solder joints is marginally higher than that of undoped solder joints. thomas jefferson boys basketball
JESD22-B117-2006 Solder Ball Shear.pdf_文档分享网 - WDFXW
WebOct 1, 2006 · SOLDER BALL SHEAR. Available format (s): Hardcopy, PDF. Superseded date: 11-22-2024. Language (s): English. Published date: 10-01-2006. Publisher: JEDEC Solid … WebShears can be mounted on a multitude of carriers, from skid steers to a PC1250. The carrier size would determine whether the shear is mounted 2nd or 3rd member. Our rental units … WebCold bump pull JEITA EIAJ ET-7407. BGA bump shear JEDEC JESD22-B117A. Cold bump pull JEDEC JESD22-B115. AU ball shear JEDEC JESD22-B116. Wire pull DT/NDT MIL STD 883 ugr wifi